Following is a listing for the industry leading companies we represent.  Simply click on the Company Logo/Name to open a new page for that company's website. - - - - - - - - - Please see further below for our listing of Equipment & Materials for Micro-Electronics/Semiconductor Assembly  Equipment and Materials for SMT-PCB Assembly & Repair PCB Handling & Conveyors Robotic Soldering Laser Marking Label Placement Stencil & Screen Printers High Speed Inspection Technology 3D SPI, 3D AOI, Conformal Coat Complete SMT Lines Pick & Place ESE Printers, Ovens, PCB Handling  Vapor Phase Soldering Technology Vacuum, Batch & In-Line Processing Cleaning Technology for PCBs Stencil, Screen & Misprint Cleaners Cleaning Chemistries  Advanced Rework & Repair SMT - BGA - QFN - CSP BGA/CSP Inspection Scopes Full HD Camera Inspection  Selective Solder Lead Form/Trim Hand Depanel Process Quality Tools:  Solderability, CAF, SIR  Ionic Contamination (ROSE/PICT) Conformal Coating Tools  High Definition Digital Inspection Systems Intelligent Component Storage Humidity & Temperature Controlled Full Data Tracking BGA/CSP Sphere Placement Wafer Balling         Equipment & Materials for Micro-Electronics/Semiconductor Assembly         Humidity Control Auto Dry Box - Dryers Electronic Desiccaters         Eureka Auto Dry Boxes & Fast Super Dryers feature full automation and friendly design.  Eureka also saves cost, time and reduces power consumption.  Millions of customers for Eureka Auto DryBoxes /   Fast Super Dryers approve of its fully automation and friendly design eliminating complicated installation and after-service.  Auto DryBox and Fast Super Dryer, are also called desiccator, electronic desiccator, humidity control box, dehumidifying cabinet, electronic dry cabinet, & low humidity storage box. Die and Chip Bonders Manual & Automated Placement to 0.5 micron      FINETECH offers a range of manual through fully automated bonders.  Their ultimate flexibility allows virtually any type of bonding process (Thermo-Compression, Thermo-Sonic, ACP/ACF, Epoxy, UV, High Force, Vacuum Bonding and Sintering) with placement accuracies to better than 1/2 micron.  The Fineplacer Lambda is the Go-To Standard for development and pilot assembly on all types of Photonic Devices, Flip Chips, 2.5D and 3D packaging.