Assembly Equipment for
IC, Semiconductor, MEMS
Photonics & MicroElectronics



Die Bond Systems
<0.5µm Accruacy
Table-Top Development to
Fully Automated Production





Wire Bonders:
Table Top Wedge & Ball Bonders
(formerly K&S)





Production Semiconductor Equipment for 
Package Singulation, Flip-Chip, Inspection, Molding, Laser Marking, Trim & Form, EMI Shields





Wire Bond Capillaries
Dicing Blades





Solder Sphere Placement 
Wafer Level & Substrate





Molds & Molding Services
Dies, Injection, Trim/Form Molds





Low Pressure Plasma
Treatment & Cleaning





Intelligent Component Storage
Humidity & Temperature Controlled
Full Data Tracking





Semiconductor, Solar & LED Equipment
Die/Wire Bonders, Cleaning
Marking, Dicing, Molding